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Embedded Intel® Solutions
Monthly Report
July 2017
TOP STORY
Big Data in Autonomous Driving
On Wednesday, Intel Corporation's Katherine Winter, Vice President of the Automated Driving Group, delivered a keynote that many would think is off-topic from the usual at ...  (more)
congatec, Inc.
Identifying the best credit card sized form factor is a major step within the design evaluation process of connected rugged mobile devices, in-vehicle systems, IoT appliances and gateways. congatec, a leading supplier of top three module standards - COM Express Mini, Qseven or SMARC 2.0 can help you decide the best module for your design.
IoT Security: Intel EPID Starts at the Silicon With a projected 100 billion IoT devices by 2020, security cannot be reliably entrusted to end users or installers deploying millions of IoT devices every ...  (more)
Gaming: Another Notch towards Respectability eSports, VR arcades, and competitive gaming for serious prize money form a growing market. Autonomous cars learn to drive by playing Grand Theft Auto.Premium PC ...  (more)
Extreme Engineering Solutions, Inc.
Extreme Engineering Solutions (X-ES), a 100% U.S.A.-based company, designs and manufactures Intel® and Freescale-based single board computers, networking products, storage products, power supplies, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.
FEATURED NEWS & ANALYSIS
X-ES’ New Server-Class Products Provide an Industry-Leading Combination of Security, Ruggedization, and Performance
New Artesyn Server Blade brings Latest Processors to Military, Aerospace and Government Networked Systems
Intel Unveils Powerful Intel Xeon Scalable Processors, Bringing Next-Generation Business and Consumer Experiences to Life
Portwell Releases COM EXPRESS® 3.0 Type 7 Basic Module Designed With Intel® Xeon® Processor D-1500 And 10GBE Interfaces
Flash Memory Summit
Summit themes include: Solid State Drives (SSDs), Flash Memory Based Architectures, Enterprise Storage, Controllers, Enterprise Applications, PCIe/NVMe SSDs, new non-volatile memory technologies, persistent memory, standards, testing, and applications. The Summit Program consists of a day of pre-conference seminars, followed by three days of panel discussions, keynotes, forums, paper sessions, tutorials, updates, and special sessions.
FEATURED WHITE PAPERS & VIDEOS
Introducing the Intel Compute Card
Terasic's DE10-Nano Kit, Built on the Intel Cyclone V FPGA, Now at Mouser Electronics
First 4K OPS Signage Solution for Three Displays – Advantech DS-280
Crystal Group Announces Next Generation Rugged Rackmount Computer Line-Up with New Intel® Xeon® Processor Family (Skylake) Architecture
Rugged mezzanine module with 10 Gigabit Ethernet ports
ARTICLES AND TECH BRIEFS
Docker Containers Ease Cloud and IoT Implementation Open-source Docker leverages Linux resource isolation features to deliver lightweight, efficient, and repeatable software delivery on complex ... (more)
The Eyes of the IoT Rely on Processor Innovation Manufacturers are increasingly using connected nodes to monitor production on the factory floor, as well as for surveillance, traffic, and retail applications. Seeking processing power that can boost (more)
FROM THE BLOGOSPHERE
HP unveils two new Pavilion all-in-one PCs starting at $750
MORE FROM THE BLOGOSPHERE
EMBEDDED INTEL® SOLUTIONS PRODUCT BRIEFS
ADLEPC Embedded PC Systems Featuring Intel® E3800 Series SBCs ()
NEW! Intel® E3800 Series Edge-Connect Architecture (ADL Embedded Solutions Inc.)
NEW! ADLE3800SEC – Intel® E3800 Series Edge-Connect Architecture (ADL Embedded Solutions Inc.)
NEW! ADLEPC – Embedded PC Family Intel® E3800 Based; Railway Rugged (ADL Embedded Solutions Inc.)
Medical Video Recording Solution (IEI Technology USA Corp.)
ATCA-7490 100/40G Packet Processing/Server Blade (Artesyn Embedded Technologies)
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