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Quarterly Report
December 2017
The Sharing Industrial Model
As the Internet of Things (IoT) and the Industrial IoT (IIoT) gain traction, Time Sensitive Networks (TSNs) are causing Ethernet networking to evolve, making it fit for the sharing ...  (more)
Teledyne LeCroy
Teledyne LeCroy, the worldwide leader in protocol test solutions, is pleased to announce the latest in High Speed Ethernet Fabric tools, the SierraNet™ T328 Protocol Analysis systems. SierraNet T328 offers users the state of the art analysis platform for the fast emerging 25G, 50G and 100G Ethernet standard and for the new 32G/128G Fibre Channel fabrics.
Minimizing Latency in Mission-Critical Video Processing Applications Why FPGAs occupy a crucial role for video processing applications as they pare down latencyThree video processing applications—degraded ...  (more)
Putting the Style in the Dial Connected vehicles and more data for the driver mean that instrument clusters in the dashboard of medium to high-end vehicles are moving to digital, configurable, personalized ...  (more)
Microchip Technology Inc.
Ethernet GigEpack Devices
Microchip's new portfolio of Gigabit Ethernet devices, the GigEpack, embodies advanced design techniques to ensure reliable operation under extreme conditions while stripping away complexity and advancing ease of use. The GigEpack provides these key elements: certified products, free drivers, copy-ready evaluation boards, and Microchip's free LANCheck® design check service.
Now shipping—compact Skylake-powered embedded computer!
Artesyn Announces New MaxCore™ Industrial PC Platform
Renesas Electronics Accelerates Industrial Ethernet Application Development with New RZ/N1 Solution Kit
Machine Learning & AI Developers Conference
Reserve this date! March 21St for the 2018 Machine Learning & AI Developers Conference. It will packed with valuable keynotes, training, technical sessions, panel discussions, machine learning and AI focused exhibits and networking opportunities with experts - all focused on the implementation of machine learning and artificial intelligence technologies.
NI Announces New IP67 Edge Nodes for the Industrial Internet of Things
Merge the worlds of wired and wireless connectivity by connecting sensors to the cloud with new TI SimpleLink™ Ethernet MCUs
Broadcom proposes to acquire Qualcomm
Embedded World 2018
Be a part of the embedded world Exhibition&Conference from 27 February to 1 March 2018 in Nuremberg, Germany. More than 1.000 exhibitors are waiting for you and the parallel specialist congresses are exactly tailored to the requirements of the embedded community parallel. Use the ticket code ew18EE to get your free ticket.
How the Embedded Space is Learning to 'Mind the Gap' Considering solutions that stretch the life of legacy deployed equipment and those which make it possible to consolidate storage functionality and virtualization capability. The author's company recently (more)
More Able than Cable HPEC Uses PCIe Interconnects for Enhanced Data Networking As network applications have increased in number over the past few decades, communication protocols have followed suit, with an estimated 150 (more)
Verifying PAM4 Performance in High-Speed Designs A close look at PAM4 helps explain why it's making a difference and how to capitalize on this innovative technology After falling behind over the past few years, Ethernet is once again tracking with (more)
Ethernet Portfolio Expansion: No Signs of Stopping The role of optics in Ethernet is undeniable. At OFC 2017 the Ethernet Alliance hosted a multivendor demo showcasing a broad array of optical technologies featuring 400G optics and form factors, cabling, (more)
SierraNet Protocol Test Systems (Teledyne LeCroy)
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Simplifying Gigabit Ethernet with GigEpack
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