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AdvancedTCA® & MicroTCA®
Quarterly Report
November 2017
TOP STORY
COM Express® Modules Boost Improvements in Ultrasound Technology Increased processing power and graphics performance in small form factor modules drives imaging advances and increased mobility in ultrasound ...  (more)
Teledyne LeCroy
Teledyne LeCroy's products include a wide range of probe connections to support XMC, AMC, VPX, ATCA, microTCA, MiniCard, Express Module, CompactPCI Serial, MidBus connectors and flexible multi-lead probes for PCIe® 1.0a, 1.1 ("Gen1" at 2.5GT/s), PCIe 2.0 ("Gen2" at 5 GT/s) and PCIe 3.0 ("Gen3" at 8 GT/s) and PCIe 4.0 ("Gen4" at 16 GT/s).
Web Aims to Reach All Corners of the Earth
A truly worldwide web is in sight, with a project to produce lower cost satellites for global Internet access and a bus technology standard that is ready for space.It ...  (more)
Broadcom proposes to acquire Qualcomm Broadcom Limited (NASDAQ: AVGO) ("Broadcom"), a semiconductor device supplier to the wired, wireless, enterprise storage, and industrial end markets, today announced ...  (more)
Machine Learning & AI Developers Conference
Reserve this date! March 21St for the 2018 Machine Learning & AI Developers Conference. It will packed with valuable keynotes, training, technical sessions, panel discussions, machine learning and AI focused exhibits and networking opportunities with experts - all focused on the implementation of machine learning and artificial intelligence technologies.
FEATURED NEWS & ANALYSIS
Teledyne LeCroy Announces New MultiPort™ Analysis for PCIe 4.0 Protocol Analyzers
N.A.T. Announces New 2U MicroTCA.4.1 Chassis for Telecom, Industrial and High Energy Physics Research Applications
High Speed ADC/DAC Module Family Extended by VadaTech
SIL 2 Certificate for QorIQ COM Module
IoT Developers Conference
The Internet of Things Developers Conference (IoT DevCon 2018) – June 5-6 at Santa Clara Convention Center – is for product developers, engineers, managers and industry influencers! Leading-edge keynotes, tech talks and panels plus an IoT products showcase from top companies exhibiting, will welcome an expected 1,500 attendees. Lunch (both days) and networking reception (June 5) is included.
New 3U VITA 62-compliant PSU Meets Power and Reliability Demands of Rugged, High Density Embedded Systems
N.A.T. Announces New MicroTCA.4.1 Low Level Radio Frequency (LLRF) Backplane for High Energy Physics Research and Telecom Applications
China Telecom and China Unicom certify u-blox NB-IoT modules
ARTICLES AND TECH BRIEFS
How the Embedded Space is Learning to 'Mind the Gap' Considering solutions that stretch the life of legacy deployed equipment and those which make it possible to consolidate storage functionality and virtualization capability. The author's company recently (more)
Delivering Carrier Grade OCP to Telco Data Centers Carriers as well as web service companies have some things in common (and some differences) when it comes to capitalizing on a common set of hardware solutions. Many communications service providers (CSPs) (more)
Verifying PAM4 Performance in High-Speed Designs A close look at PAM4 helps explain why it's making a difference and how to capitalize on this innovative technology After falling behind over the past few years, Ethernet is once again tracking with (more)
Open Source Meets Standards: A Platform for Fast Implementation Mini Linux platform utilizes COM Express modules. Like it or not, embedded development is getting more demanding. Devices like the iPad and Surface have raised the bar for the quality of the hardware, (more)
FROM THE BLOGOSPHERE
CCIX Update: TSMC, Xilinx, Cadence, Arm...and Jasper
MORE FROM THE BLOGOSPHERE
ADVANCEDTCA® & MICROTCA® PRODUCT BRIEFS
Teledyne LeCroy's PCI Express® Protocol Analysis and Test Tools (Teledyne LeCroy)
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