If you are having trouble reading this email message then please see:
http://eproductalert.com/digitaledition/atca/2009/
AdvancedTCA® & MicroTCA®
Resource Catalog
Table of Contents
- Got Mixed-Signal FPGAs?
- Platform Economics: How to Chart a Cost-Effective Course for Your Next MicroTCA® Design
- H8S/2100 BMCs
- Practical, up-to-date information on the state of AdvancedTCA and MicroTCA — at the AdvancedTCA Summit and Exhibition! Oct 27-29, 2009
Advertisers
- Adax
- ADLINK Technologies
- AdvancedTCA Summit
- Broadband World Form
- Continuous Computing
- Elma Electronic
- Emerson Network Power
- ESC Boston
- GE Fanuc
- Interphase
- LeCroy
- MicroBlade
- NESA/F9 Systems
- PDSi - Pinnacle Data Systems
- Performance Technologies
- Real - Time & Embedded
- Renesas Technology America
- Schroff
- SET - Scan Engineering Telecom
- Tundra Semiconductor
Diamond Sponsor: Performance Technologies
Performance Technologies provides pre-integrated hardware and software systems for building IP-based communication solutions. Our IPnexus® Application-Ready Systems enable companies to develop their products faster, at a lower cost, and significantly reduce time-to-market. For over 28 years we have built unmatched value into every Performance Technologies’ solution for sustaining long product life-cycles.
Click here for more
Volume: 2009
Got Mixed-Signal FPGAs?
Also in this Issue
Featured White Paper
Gold Sponsor: Elma Electronic
Elma Electronic Inc offers the widest range of AdvancedTCA and MicroTCA backplanes, system platforms, and accessories in the industry. Our latest innovations include AMC and ATCA test extender boards, low-cost “EcoBox” MicroTCA chassis, a 2nd generation rugged ATCA handle, and new MicroTCA handles and panels. Visit www.elma.com for details.
Gold Sponsor: Emerson Network Power
The Emerson Network Power ATCA-7350 high performance blade, with two quad-core Intel® Xeon® processors, delivers performance and flexibility to help drive successful implementation of next-gen telecom networks. Its PICMG® 3.1 compliant fabric interface provides 10Gbps capability, and 1Gbps interfaces to the PICMG 3.0 base interface and PICMG 3.1 fabric interface (dual star configuration).
Click Here for more
Featured Products
Chips and Cores
Chips and Cores
Hardware
Backplanes
Blades
- ATCA-7350 Multicore Processor Blade
- ATCA-9305 Many-core Processor Blade
- AdvancedTCA ThermalBlade™
- AdvancedTCA Tx/Rx BenchBlade™
- ATCA-F1 Dual AMD Socket F AdvancedTCA Blade
- ATCA-RT01 AdvancedTCA RTM with Video and Storage
Boards / Board Accessories
- PrAMC-7210 AdvancedMC Module
- iSPAN® 3650 AdvancedMC™ Quad OC-3/STM-1 ATM – GE Interworking Card
- iSPAN® 36MC2 OCTEON Plus AdvancedMC Packet Processor
Boards / Small Form Factor
- ATM4-AMC
- HDC3
- SAMC-203 RAID Array AdvancedMC Storage Module
- SAMC-504 Quad-Core AdvancedMC Processor Module
- SAMC-505 AdvancedMC Processor module
Components
Development Platform
Enclosures
Integrated Platforms
- Centellis™ 500 MicroTCA Platform
- Centellis™ 4440 ATCA 40GbE Platform Core
- IPnexus® AMP5071 MicroTCA® Application-Ready System
Packaging
Power Supply Modules
Switch Fabrics
Test & Measurement
Subscribing to Extension Media electronics development resource catalogs
We are pleased to offer our readers a free subscription to Extension Media Resource Catalogs and email newsletters- including full on-line access to www.eecatalog.com.
Extension Media Resource Catalogs provide in-depth coverage of the industry's most important platforms and technologies.
